Micro Ultrasonic Abrasive Machining for Three-dimensional Milli-structures of Hard-brittle Materials
نویسندگان
چکیده
The size of every component for opto-electrical devices or micro electro-mechanical systems (MEMS) has been reduced in recent years due to progress in opto-digital communications technology. The demands for micro-sized holes, slits and 3D structures of hard brittle materials such as ceramics and glass are considerable, and this has stimulated research into new methods and systems for a micro-mechanical fabrication [1]-[4].
منابع مشابه
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